Silicon photonics, VCSEL, optical modulators, PLC, CPO, LPO and high‑speed interconnects for AI and next‑gen data centres
High‑efficiency edge‑emitting lasers and vertical‑cavity surface‑emitting lasers (VCSELs) for data communication, sensing, and industrial applications. Available in 850 nm, 1310 nm, and 1550 nm.
4‑channel VCSEL array for 100G SR4 applications, with low threshold current and high‑speed modulation up to 28 Gbps per channel.
High‑power DFB laser for 10G‑40G applications, with integrated monitor photodiode and extended temperature range.
Integrated driver with equalisation for VCSEL arrays, supporting up to 112 Gbps PAM4 per lane.
Mach‑Zehnder modulators (MZM) and electro‑absorption modulators (EAM) for high‑speed modulation up to 100 Gbaud, suitable for PAM4 and coherent links.
Low‑Vπ MZM with high extinction ratio, integrated RF electrode, and DC bias control.
Ultra‑fast EAM with low insertion loss, supporting 100 Gbaud PAM4 and coherent transmission.
Wideband differential driver for MZM with up to 8 Vpp output, integrated DC block.
Fully integrated silicon photonic transceivers, including modulators, detectors, and wavelength multiplexing, in compact packages for 400G/800G applications.
Silicon PIC with 4×100G PAM4 Tx/Rx, integrated lasers, and grating couplers, for 400G DR4 transceivers.
Advanced silicon PIC for 800G FR4 with 8×100G lanes, integrated MUX/DEMUX and thermal tuning.
Silicon PIC with IQ modulator and balanced photodiodes for 400G/800G coherent metro applications.
Low‑loss PLC splitters, couplers, and arrayed waveguide gratings (AWGs) for WDM and optical distribution. Customisable channel spacing and split ratios.
Low‑loss 1×8 splitter for PON and distribution networks, available in 1260‑1650 nm.
High‑split‑ratio 1×32 splitter for FTTH and CATV applications, with low insertion loss.
Arrayed waveguide grating for DWDM, 100 GHz channel spacing, 40 channels, low crosstalk.
Next‑gen CPO modules integrating optical engines with switch ASICs, delivering 3.2T, 6.4T and 12.8T aggregate bandwidth with ultra‑low power per bit.
Compact CPO module with 8×400G DR4 lanes, co‑designed with 3.2T switch ASIC.
High‑density 6.4T CPO with 16×400G lanes, supporting 51.2T switch systems.
Complete electronics for CPO engines, including linear drivers and TIAs for 400G per lane.
Linear‑drive pluggable optics for 800G and 1.6T applications. Eliminate DSP for lowest latency and power – perfect for AI/ML clusters and short‑reach intra‑rack links.
800G DR8 LPO transceiver with linear driver and TIA, no DSP, latency < 5 ns.
Dual‑lane 2×400G FR4 LPO for high‑density networking, OSFP form factor.
Early‑access 1.6T LPO using 16×100G lanes, designed for next‑gen AI fabric.
Complete interconnect solutions including active optical cables (AOCs), DACs, and optical backplanes for GPU‑to‑GPU and switch‑to‑switch links.
400G AOC for short‑reach server‑to‑switch links, up to 100 m, low latency.
High‑performance 400G DAC for intra‑rack connections, lengths up to 3 m.
Embedded optical engine for backplane communication, up to 1.6T aggregate.